Xelivor
Explore our premium selection of optical modules, transformers, and shielded RJ45 modules engineered for mission-critical telecommunication platforms and dense enterprise networks.
In modern electronic design and telecommunication architecture, the imperative for miniaturization coupled with higher data throughput is driving a paradigm shift. Traditional RJ45 layouts are being replaced or augmented by compact Ethernet connectors and high-density magnetic modules. As global infrastructure marches toward 5G, edge computing, and artificial intelligence-driven data centers, backplane spaces are shrinking. Compact Ethernet connectors allow developers to save up to 50% of PCB board real estate without sacrificing signal integrity or thermal dissipation performance.
Saves critical PCB real estate through vertical SMT and low-profile packaging designs, freeing space for active components.
Integrated metal cages and internal magnetics dramatically reduce electromagnetic interference and crosstalk.
Capable of supporting data rates from 10/100 Base-T up to 10GBASE-T, keeping pace with contemporary computing demands.
Our factories utilize ultra-precise injection molding and advanced alloy stamping to construct contacts that ensure extremely low insertion force while maintaining excellent contact retention. By integration of passive components—such as resistors and capacitors—directly into the connector shell (commonly known as "Magjacks" or connectors with integrated magnetics), we eliminate the need for discrete circuit layout. This limits parasitic capacitance and delivers superior insertion and return loss metrics, essential for compliance with IEEE standards.
Compact Ethernet connectors serve as the nervous system for complex global infrastructure. They are not merely components but foundational systems operating under extreme environments.
| Sector / Vertical | Technical Demands | Preferred Architectural Solution | Xelivor Product Alignment |
|---|---|---|---|
| Enterprise Data Centers | Extreme port density, low power loss, high heat dispersion. | Ganged SFP+ cages & Vertical SMT RJ45 Jack arrays. | TE Compatible 1x4 Ports SFP+ Cage / Vertical Low Profile SMT Jack |
| Industrial Automation (IIoT) | Vibration resistance, EMI shielding, thermal stability up to 85°C. | Shielded Port Connectors with Integrated Telecom Magnetics. | 1000 Base-T Through-Hole Telecom Magnetics (QD18A11) |
| Telecommunications | PoE standard compliance, long distance fiber backhaul, surge protection. | IEEE802.3af/at Transformer modules and optical SFP transceivers. | CWDM SFP Module / IEEE802.3af 1000 Base-T Transformer QT24A03 |
| Smart Utility Grids | High noise environment tolerance, galvanic isolation. | 1000BASE-T Transformer Modules with enhanced isolation barriers. | HST-24011SXCR / HST-24037SXCR Magnetics |
Operating globally requires strict adherence to localized compliance frameworks and testing protocols. As an established exporter, our output matches the strict regulations of international markets:
Xelivor Optoelectronics Co., Ltd. is a professional manufacturer of optical transceivers and fiber connectivity solutions, dedicated to serving global data center, telecom, enterprise network, and cloud computing industries. Established in 2016, the company operates from a modern manufacturing facility covering 386 m² and has built a strong reputation for delivering reliable, high-performance optical communication products worldwide.
With over 8 years of industry experience and 6 years of export experience, Xelivor has achieved annual export revenues exceeding USD 12 million. Our products are exported to customers across North America, Europe, Southeast Asia, the Middle East, and South America, supporting a wide range of networking applications from enterprise infrastructure to hyperscale data centers.
Xelivor specializes in the design, development, and production of optical transceivers, including SFP, SFP+, SFP28, QSFP28, QSFP-DD, OSFP, DAC, and AOC solutions. Backed by a dedicated R&D team of 68 engineers, the company continuously invests in innovation and launched more than 85 new products in the past year to meet the evolving demands of high-speed optical networks.
Quality is at the core of our operations. Our quality management system incorporates incoming material inspection, in-process quality control, aging tests, compatibility verification, optical parameter testing, and final product inspection. A professional quality assurance team of 32 inspectors ensures every product meets strict international standards before shipment.
The company maintains long-term cooperation with more than 850 supply chain partners, enabling stable sourcing, efficient production, and rapid delivery capabilities. Our flexible manufacturing system supports OEM, ODM, private label, customized firmware, customized labeling, and packaging services to satisfy diverse customer requirements.
As a company with strong independent R&D capabilities, advanced testing equipment, and a customer-oriented approach, Xelivor serves distributors, system integrators, telecommunications operators, data center providers, network equipment vendors, and enterprise customers worldwide.
Driven by innovation, quality, and partnership, Xelivor Optoelectronics Co., Ltd. remains committed to providing cost-effective, reliable, and future-ready optical communication solutions for global networking infrastructure.
The trajectory of Ethernet systems points towards higher transmission limits and even denser configurations. Our core R&D efforts are currently focused on three disruptive avenues:
While standard Ethernet relies on two or four pairs of copper wires, Single Pair Ethernet (SPE) transmits data over only one pair of copper wires. This leads to dramatic reductions in connector sizes, making them exceptionally suited for automotive and smart field devices. Xelivor is currently optimizing hybrid magnetics that combine standard networks with emerging SPE systems.
As speeds transition to 400G and 800G paradigms using PAM4 encoding schemes, signal attenuation and electromagnetic leakage pose severe technical challenges. Our future products incorporate custom alloy metalization, advanced internal layout geometries, and advanced composite shielding materials.
High-density ganged configurations generate localized heat zones. Integrating specialized micro-venting routes and thermal dissipation fins directly on our press-fit cages ensures long-term operational integrity and prevents optical signal degradation in transceiver modules.
Addressing the core technical inquiries posed by hardware engineers, telecommunication architects, and purchasing agents globally.
Our comprehensive catalog covers every aspect of physical layer communication, from copper endpoints to long-reach high-speed fiber interfaces.